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销售Temptronic TPO4300A-8C31-3 高低温气流循环冲击测试机

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产品参数

选件 是否计量 发货周期 保修时间 成色
5天 90天 8成新
所在地 机身号 状态 资料下载
深圳市 完好
更新日期:2025-08-07
联系电话:0755-86016691

* 产品描述

产品描述:
 
TPO4300A 是 Temptronic(后被 inTEST 收购)推出的一款高精度高低温气流循环冲击测试设备,专为电子元器件、半导体芯片、印刷电路板(PCB)及相关组件的温度环境可靠性测试设计。该设备通过可控的高温、低温气流快速作用于被测器件(DUT),模拟极端温度变化环境,用于评估器件在温度循环冲击下的性能稳定性、失效临界点及工作特性,广泛应用于半导体制造、电子研发、失效分析等领域。
 
核心特点:
 
宽温域与高精度控制
温度范围覆盖 - 80°C 至 225°C(60Hz 条件下),可满足绝大多数电子器件的高低温测试需求;
温度控制精度达 ±0.1°C,设置与显示分辨率为 ±0.1°C,准确度符合 NIST 标准(±1.0°C),确保测试数据的可靠性。
高效气流与快速温变能力
气流输出速率为 4 至 18scfm(1.9 至 9.5L/s),高容量模式下可达 18scfm,通过强气流快速传递温度,提升温变效率;
支持快速升降温循环,缩短测试周期,适合批量器件的稳定性筛查。

 

详细信息

Product Description:
 
 
TPO4300A is a high-precision temperature-controlled hot and cold air flow circulation impact testing device launched by Temptronic (which was later acquired by inTEST). It is specifically designed for the temperature environment reliability testing of electronic components, semiconductor chips, printed circuit boards (PCBs), and related components. This device rapidly applies controlled high and low temperature air flows to the tested device (DUT), simulating extreme temperature change environments, to evaluate the performance stability, failure critical point, and working characteristics of the devices under temperature cycling impact. It is widely used in semiconductor manufacturing, electronic research and development, failure analysis, and other fields. 
 
Core features: 
 
Wide temperature range and high precision control
The temperature range covers -80°C to 225°C (60Hz condition), which can meet the high and low temperature testing requirements of most electronic devices;
The temperature control accuracy is ±0.1°C, the setting and display resolution is ±0.1°C, and the accuracy complies with the NIST standard (±1.0°C), ensuring the reliability of the test data.
Efficient airflow and rapid temperature variation capability
The airflow output rate is 4 to 18 scfm (1.9 to 9.5 L/s), and it can reach 18 scfm in high-capacity mode. Through strong airflow, temperature is quickly transferred, improving the efficiency of temperature variation;
Supports rapid temperature rise and drop cycles, shortening the test cycle, and is suitable for stability screening of batch devices.

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