This system adopts terahertz technology to accurately analyze the wiring quality of various cutting-edge semiconductor packages such as Flip Chip BGA, wafer level packaging, 2.5D/3D integrated circuits, etc. It is a TDR analysis system with world-class signal quality.
As the size of semiconductor packaging becomes smaller and integration becomes higher, people increasingly need to locate faults in a non-destructive and high-precision manner. Therefore, it is necessary to have a system that can easily create the optimal analysis environment based on different fault analysis conditions.
The TDR analysis of the TS9000 series TDR option and TS9001 TDR system utilizes our proprietary short pulse signal processing technology to perform high-resolution TDR measurements (time-domain reflection measurements) for rapid, high-precision, and non-destructive analysis of wire fault areas in cutting-edge semiconductor packaging, electronic components, and printed circuit boards.
Capable of conducting fault analysis on 2.5D_IC and 3D_iC
Fault area detection resolution:<5 μ m
Maximum measurement distance: 300mm
Automatic TDR measurement
By using the automatic touch function of the automatic detector, the system can perform precise and reproducible measurements, which helps reduce human errors.
DUT temperature control available (TS9001+external probe connection)
(Example) SUMMIT200 FFI (High/Low Temperature Models: -60 ° C to 300 ° C)
Multiple analysis software to choose from
Provide a fault location viewer that displays the fault area on CAD data. (Optional)
