Description:
The laser chemical opening machine NSC IC with opening verification function PL201 is equipped with an optical fiber laser. Compared with traditional solid-state lasers, it has lower direct costs and a longer service life.
It is an IC bottle opener pre-treatment device. It can complete the complete defect analysis of semiconductor ICs by removing and removing the EMC (epoxy resin molding compound) that protects the chips, thereby achieving faster or more efficient acid or plasma disassembly.
Feature:
Compared with the existing models that use fiber lasers, the price is lower.
Compared with other models, it reduces the contamination or damage of optical components, thereby improving durability and the reliability of performance.
The cover can be opened by * minimizing the damage to the bonding lines.
Compared with the previous model (PL101), the light spot size is less than 50% to achieve high-quality demolding results.
Real-time cameras (scalable) and S/W can be used to easily overlap X-ray images or drawing images.
Use safety-related safety interlock devices and signal tower safety inspection equipment to check the status of the equipment.
