产品描述：
该系统适用于各类高密度环境，例如移动产品的高密度返修，在这一细分市场中具有非常高的市场占有率高度的工艺模块化，使其能够在同一平台上完成所有的返修工艺步骤。 适用于从科技研究、工艺开发、模型制造，到批量生产的所有应用场合。
其工艺应用范围广泛，适合中小型 PCB 板上从 01005 微型元件直到大型BGA的所有元件，具有极高的工艺重复性。
product description:
The system is suitable for all kinds of high-density environments, such as high-density rework of mobile products. In this market segment, it has a very high market share and a high degree of process modularity, enabling it to complete all rework processes on the same platform. step. It is suitable for all applications from scientific research, process development, model manufacturing to mass production.
Its process has a wide range of applications, suitable for all components from 01005 micro-components to large-scale BGAs on small and medium-sized PCB boards, with extremely high process repeatability.
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