Description:
The fully automatic DWL 66+ laser writing system is located in an environmental chamber, which is provided with a stable environment through controlled laminar airflow and temperature stability. The chamber is mounted on a granite base and is equipped with air pads for vibration isolation. The optical system includes high-reflection mirrors and acousto-optic modulators for real-time beam correction. The semiconductor laser tube has a wavelength of 405 nm. Two writing modes are available for selection: Writing Mode I (with the minimum feature size of 0.6 um) and Writing Mode III (with the minimum feature size of 1.0 um).
Specification:
The maximum substrate size is 9 inches by 9 inches.
Minimum substrate size: 10x10mm²
The largest writing area is 200 x 200 mm².
The thickness of the substrate can reach 6 millimeters.
Interferometer resolution: 10 nm
The minimum feature size is 0.6 um (in write mode I) and 1 um (in write mode III).
Multiple data input formats (DXF, CIF, GDSII and Gerber files)
A camera system with automatic alignment and measurement functions at both macro and micro levels
