Description:
The Datacon 2200 evo plus die bonder for multi-module connection integrates various technologies on a proven platform and enhances key functions to achieve higher bonding accuracy and lower ownership costs. In addition to unparalleled flexibility and full customization possibilities, this evolved machine offers higher precision and long-term stability with a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom functionality.
The DATACON 2200 EVO high-precision multi-chip die bonder offers ultimate flexibility for chip connection and is also suitable for flip-chip applications. Equipped with an integrated dispenser, 12" wafer handling, an automatic tool changer and application-specific tools, the DATACON 2200 EVO is prepared for current and future processes and products.
Datacon 2200 evo features: PLUS precision, increased productivity, enhanced flexibility, multi-chip capability, customized flexibility, and an open platform architecture.
Features:
High Precision: X/Y placement accuracy is ±7 μm @ 3s, and Theta rotation accuracy is ±0.15° @ 3s.
High Flexibility: Supports multi-chip functionality, offers customization options, and is suitable for open platform architectures.
Advanced Vision System: Employs a new camera system and thermal compensation algorithm to enhance long-term stability and accuracy.
High-Speed Image Processing Unit: Increases placement speed while improving cleanroom functionality.
Integrated Dispenser: Supports various dispensing methods such as pressure/time, spiral, and jet, suitable for epoxy and solder.
Automatic Tool Change: Supports up to 14 pick-and-place tools, enabling fully automated multi-chip production.
Wide Substrate Compatibility: Supports various substrates including FR4, ceramic, BGA, flexible, boat-shaped, and lead frame.
