Product Description:
F-REX300X Polished 300 mm wafers. Layout with four platen and for different parallel and serial polishing modes for copper and other advanced applications.
Core advantage:
High process performance
Mass manufacturing
Energy-saving design concept
Customer specific options
High reliability
CMP experience since 1992
F-REX applications:
oxide
ILD (interlevel dielectric)
STI (Shallow ditch isolation)
tungsten
Copper for IC manufacturing
MEMs
SOI (Silicon on Insulator)
Magnetic medium
