Product Description:
The EBARA EPO-222 is a fully automated device designed for precision grinding, grinding and polishing of wafers and wafer edges. It is a high-throughput machine with a 270mm grinding and polishing area that optimizes high-volume wafer production in a cost-effective manner. The machine is well suited for handling 300 mm and 300 mm wide I/O chips, and is also capable of handling all common chip types. Powered by a 7.5HP, 2800 rpm main drive motor, the system provides optimal grinding, grinding and polishing performance without any vibration or resonance. It also has a two-stage belt drive unit and an adjustable tension machine that helps minimize the risk of damage from overload. The EBARA EPO222 includes a programmable high-speed spindle and precise linear positioning tools to aid in precise positioning and precision grinding capabilities. The spindle is driven by a high-speed micro-stepper motor, which facilitates smooth and even wafer grinding. In addition, there is an integrated variable frequency drive (VFD) to adjust the spindle speed in order to accommodate a variety of materials. The machine also contains a central grinding asset with an automatic stair feed model to help achieve fast and accurate grinding operations. It also contains a two-stage polishing device with an oscillating motor that achieves very high surface finish on the wafer edge and surface. The grinding and polishing system includes an integrated vacuum suction device to ensure clean and reliable operation. The EPO 222 comes with a cutting-edge software interface that allows full customization of system Settings such as grinding speed, power, number of passes, grinding Angle and polishing pressure. It comes with a touchscreen monitor and powerful HMI (Human Machine interface) control for easy operation and monitoring of processes. Overall, the EPO222 is a powerful and cost-effective precision wafer grinding, grinding and polishing machine with excellent performance and minimal waste. It features a powerful 7.5HP main drive motor, high-speed spindle, efficient stair feed tools and a refined HMI. This makes it an ideal asset for high-volume wafer production that efficiently handles the maximum surface mass.
