Product Description:
The DGP8761 is the successor to the DGP8760 and is used by major manufacturers worldwide. It integrates back grinding and stress relief machining for stable thin grinding to a thickness of less than 25 μm. The DGP8761 is equipped with a newly developed spindle to support high-speed grinding. This helps to reduce the processing time of thin wafers (with DGP8760). In addition, the optimized processing layout reduces cycle time (not including processing time).
Features:
Dry polishing - an environmentally friendly process that requires no chemicals or water
It is a unique dry finish by using a solution that achieves high chip strength and maintains an aspirated effect.
The newly developed UltraPoligrind grinding wheel uses micro-abrasives and can process thin wafers without the need for chemicals. Grinding wheels can achieve conventional grinding wheels while maintaining the Extrinsic Gettering effect of grinding.
By integrating DGP8761 with the multi-wafer laminator DFM2800, the mounted DAF (Chip Bonding film) can be supported for thin wafers. It can also be used for the Dicing Before Grinding process of DISCO's DBG.
