Product Description:
The ASML PAS 5500 is a high throughput i-line stepper. It utilizes 5x reduction and projection capabilities to transmit photomask patterns using light at 365 nm wavelengths to the user substrate by stepping and repeating, and is capable of reaching a resolution of 280 nm. The fully automatic wafer handling system can accommodate wafers with a diameter of 200 mm up to small pieces of substrate.
Specifications/Capabilities:
Marking dimension: 152.40mm x 152.40mm.
Supported mask thickness:
3.05 mm (0.12 in).
3.81 mm (0.15 in).
6.35 mm (0.25 in).
Maximum field of view size: 22 mm x 22 mm or 27.4 mm x 14.7 mm.
Resolution: = 280 nm.
Coverage accuracy: = 40 nm.
Numerical aperture: 0.48 to 0.60.
3D back alignment.
Transparent substrate processing.
Computer programming for image distribution and chip size optimization.
Fully automated material handling and step and repeat exposure.
Throughput: = 84 wafers per hour.
