Product Description:
The UVision 5 system's powerful optics deliver up to twice the optical density of the wafer and use its proprietary collection light path to accumulate 30 percent more scattered light than its predecessor. This capability, combined with new proprietary image processing algorithms, reduces wafer induced noise by up to 50%, enhancing the system's detection capabilities for critical monitoring applications
Features:
DUV laser, bright field and gray field technologies deliver up to twice as much light to wafers for unmatched detection sensitivity
Proprietary image processing algorithms reduce noise by 50% to capture defects on dense features
2Xnm and higher node logging tools for leading foundries and logic fabs
