Product Description:
AMAT RE12F2ECD1202 Wet process equipment is a high performance wet process equipment, widely used in semiconductor manufacturing cleaning, etching, deposition and other key steps. The equipment combines advanced electrochemical deposition (ECD) technology and wet chemical treatment technology to provide high precision and high uniformity of treatment results to meet the high requirements of wafer surface quality in semiconductor manufacturing.
Features:
The metal ions in the electrolyte are reduced on the wafer surface by electric field to form a uniform and dense deposit layer.
It can be used to deposit a variety of metals and compounds, such as copper, nickel, gold, etc.
Specific chemical agents and reaction conditions are used to remove contaminants or perform etching operations on the wafer surface.
Can be used to clean the surface of the wafer particles, organic matter, metal pollution and other impurities.
It is equipped with an advanced control system that can monitor and process key parameters such as temperature, concentration and current density in real time.
Ensure the consistency and stability of the processing effect, improve the performance and reliability of semiconductor devices.
