Product Description:
Raider-ECD-12 devices are an integral part of semiconductor manufacturing due to their superior performance and stability. The device uses advanced electrochemical deposition technology to uniformly deposit various metals or compounds on the wafer surface to meet different process requirements.
Features:
High capacity: The Raider-ECD-12 equipment has excellent capacity to handle single wafers from 150mm to 300mm, and supports automated, multi-chamber operation, greatly increasing production efficiency.
Deposition uniformity: The device uses an enhanced chamber reactor that dynamically changes the current density to ensure an unmatched uniformity of the deposited layer. This is essential to improve the performance and reliability of semiconductor devices.
Multi-zone anode array: The device is equipped with a multi-zone anode array for easy plating on ultra-thin and resistive seed layers, further improving deposition efficiency and quality.
Ionic membrane technology: The use of ionic membranes to extend the life of chemical materials, reduce material waste, reduce production costs.
Precision automation: The equipment has a "no teaching" precision automation function, avoiding the downtime caused by automatic re-teaching, thus saving costs.
