Product Description:
The AMAT/APPLIED MATERIALS Centura 5200 WxZ is a high-performance wafer etching reactor designed to provide precise control and precision for a wide range of substrates. This unique reactor is equipped with advanced ion source technology that allows etching rates of up to 300 mm across a variety of characteristics, with excellent profile repeatability of ± 8 µm. The system is optimized for small chip processing with a large 6-inch diameter chamber and temperature control options to maintain process stability and consistent chip quality. The Centura 5200 advanced ion source technology is designed to optimize target etching depth and feature repeatability. The ion source fully accelerates ionized gas, usually oxygen or chlorine, to provide excellent etching uniformity and precise control of process parameters. This ensures repeatable etching rates and minimizes damage to the substrate. The Centura 5200 also offers an optional endpoint detection package in which a laser energy beam is fired into the chamber, allowing the operator to obtain accurate etching rate and depth readings. This measurement is displayed on the reactor's main control screen, allowing for real-time process adjustment and tight control. Other features of the AMAT Centura 5200 WxZ include a wafer rotation capability that allows for up to three axes of rotation while achieving excellent uniformity. This helps maintain perfect etching quality on any surface, as well as producing greater substrate stability. In addition, the multi-gas delivery system enables precise control of gas composition and flow rate for optimized substrate processing. In summary, the APPLIED MATERIALS Centura 5200 WxZ is an advanced wafer etching reactor system with advanced ion source technology for optimal etching rate control and feature repeatability. The reactor has a variety of features that provide precise control and superior quality for small wafer processing. In addition, it offers reliable endpoint detection and multi-gas delivery options to ensure process stability and uniformity.
