Product Description:
DISCO DFD 651 is a transcription machine developed by DISCO Corporation. The equipment is mainly used for the production of crystal substrates, such as semiconductor wafers, substrates and films. The system's integrated diamond-pointed knife enables fast and precise cutting of a wide range of materials, including glass, ceramics, semiconductor layers, and various other laminates. The unit's integrated dicing table further separates the cut substrate into individual blocks. The DISCO DFD651 is equipped with a patented 3-axis marking head to control speed and depth changes during cutting. The scribing heads produce precision cuts of up to 0.01mm per pass, ensuring a reliable, repeatable product. In addition, the scribing head has an adjustable pressure to ensure consistent product quality. The picking and positioning stages of the machine use vacuum clamps that securely hold each piece in place during the scribing and cutting process. The DFD-651 can produce round and edge segments with widths between 0.2 and 3.2mm.
Features:
X-axis cutting range 210mm
Cutting speed 0.1-450mm/ SEC.
Y-axis cutting range 26mm
Index step 0.0001mm
A single error of 0.002 mm or less, more than 5 mm
Positioning accuracy is 0.002 mm or less, and the range is more than 26 mm
Scale resolution 0.0002mm
Maximum Z-axis travel 7.2mm
Moving resolution 0.00025mm
Repeat accuracy 0.001mm
Maximum blade size 55.56mm
Maximum rotation Angle :380 degrees
