Product Description:
The S450-W model is a multi-function manual welding and bonding machine with good wire control and soft substrate adaptability. The equipment is suitable for discrete devices, microwave components, optical communication devices, sensor MEMS, sound meter devices, RF modules and power devices
Features:
High precision closed loop pressure control system (accuracy less than 1g);
High solder joint stability
High-low power one-key switch
Electric drive mode without compressed air;
Excellent filament control and soft substrate adaptability
The parallelogram is a bond head with hanging structure, which is suitable for deep cavity large module devices
