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TS9001是全球顶级信号质量TDR分析系统,在日益小型化和高度集成化的电子设备的半导体封装故障分析中,需要能够根据不同的分析条件轻松创建最佳分析环境的系统。
TS9001 TDR系统利用我们专有的短脉冲信号处理技术,通过执行高分辨率TDR测量(时域反射法),对尖端半导体封装中的电线故障区域进行快速、高精度和无损分析。
此外,它还可以连接到您自己的或已选择的射频探测系统,提供与您的设备形状和故障分析环境相匹配的灵活解决方案。
特性
高速高分辨率测量
支持倒装BGAs、晶圆级封装、
2.5D/3D集成电路等。
故障区域检测分辨率:≤5 μm
测量时间:30秒(累计1,024次,是传统产品用时的1/10)
温度控制功能
当连接到具有热系统功能的射频探测系统时,系统可以在保持评估样品在低温或高温下进行故障分析。
自动化的时域反射计
利用自动探测器的自动着陆功能,系统可以进行精确的、可重复的测量,减少了人为误差。
丰富的分析软件
配备CAD数据链接,在CAD上显示故障点(可选)
TS90001 TDR Analysis System with World's Top-Class Signal Quality
In fault analysis of the semiconductor packages for increasingly smaller and more highly integrated electronic equipment, there
is a demand for a system that can easily create the optimal analysis environment according to diverse analysis conditions.
The TS9001 TDR system conducts rapid, high-precision, and non-destructive analysis of faulty areas of the wires in cuttingedge
semiconductor packages by performing high-resolution TDR measurement (time domain reflectometry) utilizing our
proprietary short-pulse signal processing technology.
In addition, it can be connected to a radio-frequency probing system that you own or have selected, providing flexible solutions
that match your device shape and fault analysis environment.
Features
High-speed and high-resolution measurement
Support for fault analysis of flip-chip BGAs, wafer level packages,
and 2.5D/3D ICs, etc.
Resolution for faulty area detection: 5 μm or less
Measurement time: 30 sec. (accumulated 1,024 times, 1/10
when compared with our conventional product)
Temperature control function
When connected to the radio-frequency probing system with a
thermal system function, the system can perform fault analysis
while keeping evaluation samples at a low or high temperature.
Automated TDR measurement
By using the auto touch-down function of the auto prober, the
system conducts precise and reproducible measurements,
contributing to a reduction of human errors.
Rich analysis software
Equipped with CAD Data Link, which displays fault points on the CAD
(optional)
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