2650 系列大功率 SourceMeter SMU 仪器专为高电压/电流电子产品和功率半导体元件（例如二极管、FET 和 IGBT、高亮度 LED、直流至直流转换器、电池、太阳能电池及其他高功率材料、组件、模块和部件）的检定和测试而设计。 它们提供前所未有的功率、精度、速度、灵活性、易用性，可提高研发、生产测试和可靠性环境中的效率。 两种仪器可以提供高达 3000V 或高达 2000W 的脉冲电流功率。
特点： 优势：
高度灵活的四象限电压和电流源/负载，与高精度电压表和电流表相耦合
提供相比同类产品颇具优势的性能，具有 6½ 位分辨率。
源或阱 (2651A) 脉冲功率高达 2000W（±40V、±50A），或直流电源高达 200W（[email protected]@[email protected]）；轻松连接两个器件（串联或并联）创建高达 ±100A 或 ±80V 的解决方案
支持功率半导体、HBLED、光学设备、太阳能电池、GaN、SiC 和其他复合材料与设备的检定/测试。应用范围包括半导体接点温度检定；高速、高精度数字化；电迁移研究；以及高电流、高功率设备测试。
源或阱 (2657A) 直流或脉冲功率高达 180W（[email protected]@120mA）
提供功率半导体器件检定和测试所需的高压，包括 GaN、SiC 及其他复合材料和器件、高达 3kV 的故障和漏电测试以及亚毫秒瞬态检定。
内置基于网络浏览器的软件
支持通过任何浏览器、任何计算机、从全球任何地方进行远程控制。
有数字化或积分测量模式可供选择
支持精确检定瞬态和稳态行为，包括快速变化的热效应。
TSP（测试脚本处理）技术
可以与 2657A 型与 2600B 系列型号轻松地进行系统集成。
TSP-Link 通道扩展总线
让多台 2651A 和 2657A 与所选 2600B 系列 SMU 仪器组合成多达 32 条通道的集成系统。
兼容于 8010 型高功率设备测试夹具和 8020 型高功率接口面板
为封装部件或晶片级高功率设备测试提供安全而方便的连接。
免费的测试脚本构建器软件工具
帮助您创建、修改、调试和存储 TSP 测试脚本。
选配的 ACS 基础半导体元器件检定软件
开发、质量检验或故障分析期间执行封装部件检定时，较大限度地提高工作效率。
The 2650 series of high-power SourceMeter SMU instruments are designed for high-voltage/current electronic products and power semiconductor components (such as diodes, FETs and IGBTs, high-brightness LEDs, DC to DC converters, batteries, solar cells and other high-power materials, components, modules And components) for verification and testing. They provide unprecedented power, accuracy, speed, flexibility, ease of use, and can improve efficiency in R&D, production testing, and reliability environments. Both instruments can provide pulse current power up to 3000V or up to 2000W.
Features: Advantages:
Highly flexible four-quadrant voltage and current sources/loads, coupled with high-precision voltmeters and ammeters, provide superior performance compared to similar products, with a resolution of 6½ digits.
Source or sink (2651A) pulse power up to 2000W (±40V, ±50A), or DC power supply up to 200W (±10V@±20A, ±20V@±10A, ±40V@±5A); easily connect two devices (in series) Or in parallel) to create solutions up to ±100A or ±80V. Support the verification/testing of power semiconductors, HBLEDs, optical devices, solar cells, GaN, SiC and other composite materials and equipment. Applications include semiconductor contact temperature verification; high-speed, high-precision digitization; electromigration research; and high-current, high-power equipment testing.
Source or sink (2657A) DC or pulse power up to 180W (±3000V@20mA, ±1500V@120mA) Provides high voltage required for power semiconductor device verification and testing, including GaN, SiC and other composite materials and devices, up to 3kV failure And leakage test and sub-millisecond transient verification.
The built-in web browser-based software supports remote control through any browser, any computer, and from any place in the world.
There are digital or integral measurement modes to choose from. Supports accurate verification of transient and steady-state behavior, including fast-changing thermal effects.
TSP (Test Script Processing) technology allows easy system integration with 2657A and 2600B series models.
The TSP-Link channel expansion bus allows multiple 2651A and 2657A to be combined with selected 2600B series SMU instruments into an integrated system with up to 32 channels.
Compatible with 8010 high-power equipment test fixture and 8020 high-power interface panel Provide safe and convenient connections for packaged components or wafer-level high-power equipment testing.
The free test script builder software tool helps you create, modify, debug and store TSP test scripts.
The optional ACS basic semiconductor component verification software performs package component verification during development, quality inspection or failure analysis, which greatly improves work efficiency.
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